At SEMICON Europe 2026, Festo will demonstrate how wafers can be moved efficiently, precisely and reliably through the semiconductor manufacturing process. A networked demonstration system illustrates the complete workflow, from the FOUP through wafer alignment to further processing in wet chemical or vacuum-based applications.

The rising demand for specialised semiconductors – ranging from MEMS and SiC PowerChips to 2 nm GPUs and AI accelerators – is increasing the pressure on fabs and OEMs to operate their equipment cost-effectively whilst maintaining high process stability and repeatability. With solutions based on Controlled Pneumatics, a new generation of digitally controlled pneumatic technology, Festo supports machine builders and semiconductor manufacturers in optimising process stability whilst reducing the use of process media and energy consumption.

Festo, one of the world's leading manufacturers of automation technology, is fully integrating Eichenberger Gewinde AG from Burg in Switzerland as of 1 April 2026. In future, the Swiss company will operate under the name "Festo Gewindetriebe AG".