At SEMICON Europe 2026, Festo will demonstrate how wafers can be moved efficiently, precisely, and reliably through the semiconductor manufacturing process. A networked demonstration system illustrates the complete workflow—from the FOUP through wafer alignment to further processing in wet chemical or vacuum-based applications.

The growing demand for specialized semiconductors—ranging from MEMS and SiC PowerChips to 2-nm GPUs and AI accelerators—is increasing the pressure on fabs and OEMs to operate their equipment cost-effectively while maintaining high process stability and repeatability. With solutions based on Controlled Pneumatics—a new generation of digitally...