At SEMICON Europe 2026, Festo will demonstrate how wafers can be moved efficiently, precisely, and reliably through the semiconductor manufacturing process. A networked demonstration system illustrates the complete workflow—from the FOUP through wafer alignment to further processing in wet chemical or vacuum-based applications.

The growing demand for specialized semiconductors—ranging from MEMS and SiC PowerChips to 2-nm GPUs and AI accelerators—is increasing the pressure on fabs and OEMs to operate their equipment cost-effectively while maintaining high process stability and repeatability. With solutions based on Controlled Pneumatics—a new generation of digitally controlled pneumatic technology—Festo helps machine builders and semiconductor manufacturers optimize process stability while reducing media consumption and energy usage.

Festo, one of the world's leading manufacturers of automation technology, is fully integrating Eichenberger Gewinde AG from Burg in Switzerland as of April 1, 2026. In future, the Swiss company will operate under the name "Festo Gewindetriebe AG".

Controlled Pneumatics is the revolutionary compressed air technology from Festo that is opening up new perspectives for pneumatics. Thanks to this technology, the pressure control of the compact proportional valve terminal VTEP is extremely sensitive, down to less than 1 mbar. This is perfect for applications such as wafer polishing or patch clamping in life science. In addition, Controlled Pneumatics uses high-precision piezo valves to reduce compressed air consumption by up to 50%.