This content was translated automatically.

Bild
Owner
Festo SE & Co. KG
ID: 5244

End-to-end wafer handling processes for greater efficiency and precision

Integrated automation solutions from Festo for semiconductor manufacturing at Semicon Europe
At SEMICON Europe 2026, Festo will demonstrate how wafers can be moved efficiently, precisely and reliably through the semiconductor manufacturing process. A networked demonstration system illustrates the complete workflow, from the FOUP through wafer alignment to further processing in wet chemical or vacuum-based applications.

At the centre of an exhibit on Festo’s stand is a handling cell – the so-called transfer chamber – which simulates a wafer’s journey through various process steps. The starting point is an industry-standard transport container for substrates – a so-called FOUP (Front Opening Unified Pod) – from which the wafers are removed.

Here, Festo relies on an inverted gantry system as a cost-effective alternative to conventional SCARA robots. The system enables the precise removal and transport of wafers between storage and processing stations.

A particular highlight is the end-effector used, which features an integrated wafer aligner. It combines gripping and positioning in a compact solution. This reduces the installation space required and the complexity of the system, whilst ensuring precise alignment.

Wet chemical processes and coating

Even before removal, a nitrogen purge of the FOUP, controlled by a mass flow regulator from Festo, ensures a controlled, low-contamination environment. The wafer is then fed to a coating station. There, an electric linear axis moves a dispensing nozzle precisely over the wafer.

Precision for vacuum processes

In a further step, the wafer is transported to a vacuum application, such as that used in dry etching. The system demonstrates how a specialised technology from Festo controls and gently actuates a wafer transfer valve (gate valve) to transfer the wafer into the vacuum chamber with minimal vibration and free from particles.

Inside the chamber, a pneumatic pin-lift system lifts the wafer onto a wafer chuck without causing any vibration. After the process, the system lifts the wafer off the chuck again with particular care and under force monitoring.

A pneumatic micro-positioning system positions components such as focus rings with micrometre-level precision. In this way, Festo demonstrates how integrated automation solutions can help to increase throughput, process stability and quality in modern semiconductor manufacturing.

Qualification required

Targeted training programmes are provided by Festo Didactic. The offering includes practical ‘hands-on’ training at the plants, the establishment of in-house training facilities, and digital learning content on the Festo Learning Experience (Festo LX) – including topics relating to sustainability.

Festo at Semicon Europe in Munich: Hall C1, Stand C1337

About Festo

Festo is a global player and an independent family-owned company with headquarters in Esslingen am Neckar, Germany. Festo has set standards in industrial automation technology and technical education ever since its establishment, thereby making a contribution to sustainable development of the environment, the economy and society. The company supplies pneumatic and electrical automation technology to 300,000 customers of factory and process automation in over 35 industries. Digitalization, AI and the LifeTech sector with medical technology and laboratory automation are becoming increasingly important. The products and services are available in 176 countries. With about 20,600 employees in over 250 branch offices in around 60 countries worldwide, Festo achieved a turnover of around €3.33 billion in 2025. More than 8% of this turnover is invested in research and development. In this learning company, 1.5 % of turnover is invested in basic and further training. Festo Didactic SE is a leading provider of technical education and training and offers its customers worldwide comprehensive digital and physical learning solutions in the industrial environment.

Wafer handling
Transfer chamber simulating a wafer’s journey through various process steps – including an inverted gantry system, the cost-effective alternative to a SCARA robot.