At SEMICON Europe 2026, Festo will demonstrate how wafers can be moved efficiently, precisely and reliably through the semiconductor manufacturing process. A networked demonstration system illustrates the complete workflow, from the FOUP through wafer alignment to further processing in wet chemical or vacuum-based applications.

The rising demand for specialised semiconductors – ranging from MEMS and SiC PowerChips to 2 nm GPUs and AI accelerators – is increasing the pressure on fabs and OEMs to operate their equipment cost-effectively whilst maintaining high process stability and repeatability. With solutions based on Controlled Pneumatics, a new generation of digitally...